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Products
Open Short Tester/Handler
Strip Handler with OS Test
Qtest offers a comprehensive solution for IC assembly by providing a handler with OS test capability. The tester integrated with handler is placed in line after the wire bonders and allows immediate confirmation of bond connections. This allows users to detect any problems arising from the wire bonder before ICs are sent out for molding and final test. IC assemblers will also eliminate faulty devices from being further processed down the production line and incurring additional cost and increasing the cost of rework.
The input loader can take up to 5 magazines at one time each with 20 strips. The typical UPH for a 400 ball device is 1800. Data-logging is available to allow for failure traceability.
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Commercial BGA Strip device that can be tested with Qtest’s Strip Handler with Test |
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2 different version of Qtest BGA Strip Handler with test. |
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Qtest innovative design where the Panther OS tester sits on a trolley that easily docked onto the handler for easy change of load board or socket. |
